Title:
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/286856
Kind Code:
A1
Abstract:
This copper/ceramic bonded body (10) has copper members (12, 13) made of copper or a copper alloy and a ceramic member (11), wherein the copper members (12, 13) are bonded to the ceramic member (11). An active metal compound layer (21) is formed on the ceramic member (11) side of the bonding interface between the ceramic member (11) and the copper member (12). The maximum value of indentation hardness in a region extending 20 μm to 50 μm toward the copper member (12) from the interface between the copper member (12) and the active metal compound layer (21) is in the range of 120 mgf/μm2 to 200 mgf/μm2. The difference between the maximum value HA of indentation hardness in a peripheral region (A) of the copper member (12) and the maximum value HB of indentation hardness in a central region (B) of the copper member (12) is 50 mgf/μm2 or less.
Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2022/027834
Publication Date:
January 19, 2023
Filing Date:
July 15, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C04B37/02; B23K1/00; B23K1/19; H01L23/13; H05K3/38
Domestic Patent References:
| WO2021124923A1 | 2021-06-24 | |||
| WO2021117327A1 | 2021-06-17 | |||
| WO2018021472A1 | 2018-02-01 | |||
| WO2013018504A1 | 2013-02-07 |
Foreign References:
| JP2021095327A | 2021-06-24 | |||
| JP2016032032A | 2016-03-07 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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