BONDED BODY OF OBJECT TO BE BONDED TO AND FUNCTIONAL BASE MATERIAL

Title:

BONDED BODY OF OBJECT TO BE BONDED TO AND FUNCTIONAL BASE MATERIAL

Document Type and Number:

WIPO Patent Application WO/2021/112210

Kind Code:

A1

Abstract:

Provided is a bonded body in which a functional base material is attached to an object to be bonded to, such as a rotating body subjected to wind or other fluid, a vehicle, or a building, the functional base material and the object being bonded together with an end portion of the functional base material being filled, wherein the operational effect of the functional base material is neither lost nor adversely affected by the fluid, and wherein the bonded body has a strong bonding property preventing the functional base material from peeling off from the end portion due to weather, and a peelability allowing the functional base material to be peeled for repair or mending. Provided is a bonded body 1 of an object 50 to be bonded to and a functional base material 10, in which the functional base material 10 is provided on a curved surface 51 of the object 50 to be bonded to along the curved surface 51 and/or a smooth surface of the object 50 to be bonded to. The functional base material 10 has a peripheral side surface 14 with a peripheral distal-most end portion 15. A peripheral gap part 21 is provided between the object 50 to be bonded to and the functional base material 10 on the inside of the peripheral distal-most end portion 15 and on the side opposing the object 50 to be bonded to. The peripheral gap part 21 is filled with a holding member 20 extending in a laminar fan shape from the peripheral side surface 14, along the curved surface 51 and/or the smooth surface.

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Inventors:

WATANABE NOBUYOSHI (JP)
SATO HIDEAKI (JP)
TAKEYAMA MASASHI (JP)
ORYU YUKIHIRO (JP)

Application Number:

PCT/JP2020/045168

Publication Date:

June 10, 2021

Filing Date:

December 04, 2020

Export Citation:

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Assignee:

ASAHI RUBBER INC (JP)
HOKUTAKU CO LTD (JP)

International Classes:

F03D80/00; B32B7/04; B64C21/10; F15D1/12

Domestic Patent References:

WO2012102294A1

2012-08-02

Foreign References:

JP2003180027A

2003-06-27

Other References: