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Title:
BONDED MEMBER AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/178439
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a bonded member such as a microchip plate, in which the material of a bonding layer for bonding bases that are specifically formed of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) is modified; and a method for producing the bonded member. A microchip plate (1) according to one embodiment of the present invention is obtained by bonding a first base (2) and a second base (3) with a bonding layer (5) being interposed therebetween, and is characterized in that the first base (2) and the second base (3) are formed of a COP or a COC and the bonding layer (5) is formed to contain a polymer of an α-olefin (10).

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Inventors:
TANIGUCHI YOSHINAO (JP)
Application Number:
PCT/JP2014/062171
Publication Date:
November 06, 2014
Filing Date:
May 02, 2014
Export Citation:
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Assignee:
ALPS ELECTRIC CO LTD (JP)
International Classes:
B32B27/00; B32B3/26; C08J5/12; C09J4/00; C09J5/00
Domestic Patent References:
WO2008050791A12008-05-02
WO2012077383A12012-06-14
Foreign References:
JP2008076208A2008-04-03
JP2000512683A2000-09-26
JP2012066518A2012-04-05
JP2005344022A2005-12-15
Attorney, Agent or Firm:
NOZAKI, Teruo (JP)
Teruo Nozaki (JP)
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