Title:
BONDED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING BONDED PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/243157
Kind Code:
A1
Abstract:
Provided is a bonded printed wiring board which can improve transmission characteristics and which has a structure in which space saving of a joint portion is achieved. A bonded printed wiring board 1 according to an embodiment of the present invention comprises: a printed wiring board 10 having a signal wire 11, a pair of ground wires 12 which sandwich the signal wire 11, and an insulation substrate 13; and a printed wiring board 20 having a signal wire 21, a pair of ground wires 22 which sandwich the signal wire 21, and an insulation substrate 23. The signal wire 11 is provided in the insulation substrate 13, an end of the signal wire 11 is exposed on an exposed surface 14a of the insulation substrate 13 at a portion where the thickness is locally reduced, and/or the signal wire 21 is provided in the insulation substrate 23, and an end of the signal wire 21 is exposed on an exposed surface 24a of the insulation substrate 23 at a portion where the thickness is locally reduced. The printed wiring board 10 and the printed wiring board 20 are bonded such that the end of the signal wire 11 faces and is electrically connected to the end of the signal wire 21.
Inventors:
SHIGEOKA TAKESHI (JP)
Application Number:
PCT/JP2023/008291
Publication Date:
December 21, 2023
Filing Date:
March 06, 2023
Export Citation:
Assignee:
NIPPON MEKTRON KK (JP)
International Classes:
H05K1/14; H05K1/02
Domestic Patent References:
| WO2016072338A1 | 2016-05-12 |
Foreign References:
| JP2014011528A | 2014-01-20 | |||
| JP2002325001A | 2002-11-08 | |||
| JPS61197701U | 1986-12-10 | |||
| JPH0590728A | 1993-04-09 | |||
| JPH0923107A | 1997-01-21 |
Attorney, Agent or Firm:
OKUMACHI Tetsuyuki (JP)
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