Title:
BONDED STATE PREDICTION SYSTEM, BONDED STATE PREDICTION METHOD, BONDED STATE PREDICTION PROGRAM AND METHOD FOR PRODUCING BONDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/219082
Kind Code:
A1
Abstract:
A bonded state prediction system according to the present invention predicts the bonded state of an adhesive object and an adherend when the adhesive object is bonded to the adherend; and this bonded state prediction system comprises a data acquisition unit which acquires two or more pieces of data including physical property information of the object on the two-dimensional coordinates, and a bonded state prediction unit which predicts the bonded state of the object and the adherend using the thus-acquired two or more pieces of data.
Inventors:
TAKEMURA CHIYOKO
YAMADA TETSUYA
OKUBO YASUSHI
YAMADA TETSUYA
OKUBO YASUSHI
Application Number:
PCT/JP2023/017451
Publication Date:
November 16, 2023
Filing Date:
May 09, 2023
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
C09J5/00; C09J201/00; G01N21/64
Foreign References:
| JP2000094892A | 2000-04-04 | |||
| JP2008069243A | 2008-03-27 | |||
| JP2021156618A | 2021-10-07 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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