Title:
BONDED STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTIVE MEMBER FOR SOLDER BONDING, AND STRUCTURE FOR SOLDER BONDING
Document Type and Number:
WIPO Patent Application WO/2024/070628
Kind Code:
A1
Abstract:
A bonded structure which comprises a first conductive member, a second conductive member, and a solder bonding part for bonding the first conductive member and the second conductive member to each other, wherein at least one of the first conductive member and the second conductive member contains a metal and particles of a layered material that comprises one or more layers.
Inventors:
HIOKI YASUNORI (JP)
SASAKI KAZUARI (JP)
NISHIHARA MAYUKO (JP)
SASAKI KAZUARI (JP)
NISHIHARA MAYUKO (JP)
Application Number:
PCT/JP2023/033022
Publication Date:
April 04, 2024
Filing Date:
September 11, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B23K1/00; B22F1/00; B22F1/103; B22F1/12; B23K1/19; B23K1/20; C22C1/10; H01B1/22; H05K1/09
Foreign References:
| CN111505065A | 2020-08-07 | |||
| JP2020093971A | 2020-06-18 | |||
| JP2022519403A | 2022-03-24 | |||
| JP2022122629A | 2022-08-23 | |||
| US20180338352A1 | 2018-11-22 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
Download PDF: