Title:
BONDED STRUCTURE AND PRODUCTION METHOD FOR BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/117502
Kind Code:
A1
Abstract:
A bonded structure having a bonding area in which a metal member and a resin member are bonded. A recessed section having an opening in the surface of the metal member is formed in a bonding area in the metal member, the resin member is filled into the recessed section in the metal member, and a thin section in which the thickness of the metal member is reduced is provided in an area in the metal member, said area including the bonding area and an adjacent area that is adjacent to the bonding area.
Inventors:
NISHIKAWA KAZUYOSHI (JP)
Application Number:
PCT/JP2016/051276
Publication Date:
July 28, 2016
Filing Date:
January 18, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B29C65/16; B23K26/324; B23K26/354
Foreign References:
| JP2014018995A | 2014-02-03 | |||
| JP2014091263A | 2014-05-19 | |||
| JP2003001455A | 2003-01-08 | |||
| JP2014166693A | 2014-09-11 | |||
| JP2009226643A | 2009-10-08 | |||
| JP2014177051A | 2014-09-25 |
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
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