Title:
BONDING AGENT SET AND BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/020506
Kind Code:
A1
Abstract:
A bonding agent set is provided with: a first liquid containing one or more acrylic monomers having two or more (meth)acryloyl groups and an epoxy resin having two or more epoxy groups; and a second liquid containing a curing agent, said curing agent including a compound having a nucleophilic reactive group that reacts with the epoxy groups and with the (meth)acryloyl groups. The acrylic monomers include a bifunctional acrylic monomer having two (meth)acryloyl groups. The ratio of the bifunctional acrylic monomer to the total mass of acrylic monomers is 75 mass% or more.
Inventors:
MATSUNAGA MASAHIRO (JP)
FUJIYASU YOSUKE (JP)
OJI MASASHI (JP)
KAWAMORI TAKASHI (JP)
FUJIYASU YOSUKE (JP)
OJI MASASHI (JP)
KAWAMORI TAKASHI (JP)
Application Number:
PCT/JP2020/029218
Publication Date:
February 04, 2021
Filing Date:
July 30, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J4/02; C09J163/00
Foreign References:
US4051195A | 1977-09-27 | |||
JP2002275242A | 2002-09-25 | |||
JP2017519869A | 2017-07-20 | |||
JPH09296027A | 1997-11-18 | |||
JPH0195176A | 1989-04-13 | |||
JP2012211244A | 2012-11-01 | |||
JP2007518840A | 2007-07-12 | |||
JPH08295864A | 1996-11-12 | |||
JPH08325358A | 1996-12-10 | |||
JPH10182938A | 1998-07-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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