Title:
BONDING CAPILLARY
Document Type and Number:
WIPO Patent Application WO/2017/006880
Kind Code:
A1
Abstract:
Provided is a bonding capillary which is characterized in that: the bonding capillary is provided with a body comprising a through-hole into which a wire is inserted, a first pressing face which presses on the wire and has a first sloping face provided in the periphery of the through-hole and inclining along the extending direction of the through-hole, and a second pressing face which presses on the wire and has a tapered face provided between the first sloping face and the through-hole and a second sloping face provided between the tapered face and the first sloping face; and the root-mean-square gradient of the roughness curve element on the second sloping face is smaller than the root-mean-square gradient of the roughness curve element on the first sloping face.
More Like This:
| JP2022551843 | Ex-situ fabrication of metal microwires and FIB placement in IC circuits |
| JPH03153050 | SEMICONDUCTOR DEVICE |
Inventors:
OKA SOICHIRO (JP)
ONISHI JUMPEI (JP)
ISHITSUKA YUJI (JP)
MOTOMURA KENICHI (JP)
ONISHI JUMPEI (JP)
ISHITSUKA YUJI (JP)
MOTOMURA KENICHI (JP)
Application Number:
PCT/JP2016/069699
Publication Date:
January 12, 2017
Filing Date:
July 01, 2016
Export Citation:
Assignee:
TOTO LTD (JP)
International Classes:
H01L21/60
Foreign References:
| US5662261A | 1997-09-02 | |||
| JP2014082450A | 2014-05-08 | |||
| JPH0274051A | 1990-03-14 |
Attorney, Agent or Firm:
HYUGAJI, Masahiko et al. (JP)
Download PDF: