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Patent Searching and Data


Title:
BONDING DEVICE AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/220504
Kind Code:
A1
Abstract:
Provided are a bonding device and a bonding method that are capable of properly positioning workpieces and more accurately bonding together the workpieces even if each of the workpieces has a bonding surface that includes a concave-convex curved surface in which a protruding curved surface is continuous with a recessed curved surface. The bonding device includes: an upper suction stand 4 which holds, by suction, a first workpiece W1 that has been formed into a concave-convex curved shape in advance; and a lower suction stand 6 that holds, by suction, a flat second workpiece W2. The lower suction stand 6 includes a fixed suction stand 16 and a movable suction stand 17, and an upper opening surface of the movable suction stand 17 is covered by a suction screen 8. The movable suction stand 17 can be raised and lowered between a workpiece supporting position where the flat second workpiece W2 is held by suction and a workpiece transferring position where the movable suction stand 17 is lowered below an upper opening surface of the fixed suction stand 16. At the workpiece transferring position, the second workpiece W2 is held by suction along the shape of a concave-convex curved section 18 of the fixed suction stand 16. With the first workpiece W1 and the second workpiece W2 vertically facing each other, the second workpiece W2 is pressed against the first workpiece W1 by a bonding roller 7 and is bonded to the first workpiece W1.

Inventors:
KOMODA DAISUKE (JP)
Application Number:
PCT/JP2020/018386
Publication Date:
November 04, 2021
Filing Date:
May 01, 2020
Export Citation:
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Assignee:
CLIMB PRODUCTS CO LTD (JP)
International Classes:
B32B37/00
Domestic Patent References:
WO2018198194A12018-11-01
Foreign References:
JP2011194607A2011-10-06
JP2010094910A2010-04-30
JP2015039862A2015-03-02
JP2013139108A2013-07-18
JP2001138482A2001-05-22
US20170255033A12017-09-07
JP2015167214A2015-09-24
CN205819648U2016-12-21
JP2015039862A2015-03-02
Other References:
See also references of EP 4144529A4
Attorney, Agent or Firm:
MORIMOTO Satoshi (JP)
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