Title:
BONDING DISSIMILAR MATERIALS USING RADIO FREQUENCY WAVE CURING
Document Type and Number:
WIPO Patent Application WO/2022/031409
Kind Code:
A8
Abstract:
A method is provided for bonding substrates having dissimilar coefficients of thermal expansion, using a thermoset adhesive. The method involves a pre-cure step using radio-frequency energy, followed by a heat-curing step.
More Like This:
| JP4668402 | Thermal adhesive material |
| JP2848971 | [Title of Invention] Adhesion method of thin plate |
| JP2005505677 | How to bond wood-based materials |
Inventors:
GREEN MICAH (US)
GREUNER JACOB (US)
VASHISTH ANIRUDDH (US)
AUVIL TYLER (US)
SOPHIEA DANIEL (US)
MASTROIANNI SARAH (US)
GREUNER JACOB (US)
VASHISTH ANIRUDDH (US)
AUVIL TYLER (US)
SOPHIEA DANIEL (US)
MASTROIANNI SARAH (US)
Application Number:
PCT/US2021/041413
Publication Date:
May 19, 2023
Filing Date:
July 13, 2021
Export Citation:
Assignee:
DDP SPECIALTY ELECTRONIC MAT US LLC (US)
THE TEXAS A & M UNIV STYSTEM (US)
THE TEXAS A & M UNIV STYSTEM (US)
International Classes:
C09J5/06; C09J11/04; C09J11/08
Attorney, Agent or Firm:
XU, Hong (US)
Download PDF:
Previous Patent: LOAD CENTER THAT REDUCES TRIP TIME DURING SHORT CIRCUIT FAULTS
Next Patent: ANTISENSE OLIGONUCLEOTIDES TARGETING SARS-COV-2
Next Patent: ANTISENSE OLIGONUCLEOTIDES TARGETING SARS-COV-2