Title:
BONDING JOINT FOR BONDING TO RESIN, BONDING JOINT MANUFACTURING METHOD, AND METAL-RESIN BONDING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/074659
Kind Code:
A1
Abstract:
The present invention provides a metal-resin bonding structure having increased bonding strength. A bonding joint 1 is formed in a drum shape having a groove-shaped recessed section 13 that is formed in the circumferential direction of a substantially cylindrical metal side surface 11a, and a curved section 14 that curves between two bottom surfaces 12. The recessed section 13 and upper and lower end sections 15 of the side surface 11 form a coarse relief shape 101, and the side surface 11 including the recessed section 13 serves as a bonding surface 10. A fine relief shape 100 having an arithmetic mean roughness Ra of 10-300 μm is formed on the bonding surface 10. By forming the coarse relief shape 101 and the fine relief shape 100 on the bonding surface 10, the bonding joint 1 strongly bonds with a resin.
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Inventors:
SUZUKI TATSUYA (JP)
KOIKE TAKEHIRO (JP)
KOIKE TAKEHIRO (JP)
Application Number:
PCT/JP2022/039634
Publication Date:
May 04, 2023
Filing Date:
October 25, 2022
Export Citation:
Assignee:
CHUO MALLEABLE IRON CO LTD (JP)
International Classes:
B22C1/00; B29C65/70
Domestic Patent References:
| WO2016117711A1 | 2016-07-28 | |||
| WO2022019339A1 | 2022-01-27 |
Foreign References:
| JP2019035482A | 2019-03-07 |
Attorney, Agent or Firm:
IIDA, Akio et al. (JP)
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