Title:
BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATERIAL COMPOSITION, BONDING FILM, METHOD FOR MANUFACTURING BONDED BODY, AND BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/157831
Kind Code:
A1
Abstract:
Provided are a bonding material composition whereby shear strength, heat resistance, electrical conductivity, and heat dissipation properties of a bonding layer can be enhanced, a method for manufacturing the bonding material composition, a bonding film, a method for manufacturing a bonded body, and a bonded body. The bonding material composition pertaining to the present invention is characterized by including a flux and metal particles (P) including first metal particles (P1) and second metal particles (P2), the first metal particles (P1) being constituted from a core (C1) comprising Cu, and a Cu2O layer that covers the core (C1), and the second metal particles (P2) being constituted from a core (C2) comprising Cu, and Sn or a solder containing Sn that covers the core (C2).
Inventors:
NITTA NORZAFRIZA (JP)
FUJIWARA HIDEMICHI (JP)
FUJIWARA HIDEMICHI (JP)
Application Number:
PCT/JP2023/004946
Publication Date:
August 24, 2023
Filing Date:
February 14, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
B23K35/22; B22F1/00; B22F1/16; B22F1/17; B23K1/00; B23K35/363; H01B1/22
Domestic Patent References:
| WO2006075459A1 | 2006-07-20 | |||
| WO2017138255A1 | 2017-08-17 | |||
| WO2018025798A1 | 2018-02-08 | |||
| WO2017007011A1 | 2017-01-12 |
Foreign References:
| JP2019059967A | 2019-04-18 | |||
| JP2014156626A | 2014-08-28 | |||
| JP2011062736A | 2011-03-31 | |||
| JP2013212524A | 2013-10-17 | |||
| JP2020040075A | 2020-03-19 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
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