Title:
BONDING MEMBER, BONDING STRUCTURE, INTERMEDIATE STRUCTURE FOR BONDING, AND METHOD FOR MANUFACTURING BONDING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/024921
Kind Code:
A1
Abstract:
A bonding member used for bonding a plurality of members, the bonding member being provided with a wire and a holding part for holding the wire, the holding part containing a resin that is melted by heat generated by channeling a current through the wire.
Inventors:
TOBIISHI KOKI (JP)
TSUBOI HIDEAKI (JP)
TSUBOI HIDEAKI (JP)
Application Number:
PCT/JP2021/027310
Publication Date:
February 03, 2022
Filing Date:
July 21, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B29C65/34; B60J5/10
Foreign References:
| JPH01210330A | 1989-08-23 | |||
| JP2011158007A | 2011-08-18 | |||
| JP2013129159A | 2013-07-04 | |||
| JP4105519B2 | 2008-06-25 | |||
| JP2000037781A | 2000-02-08 | |||
| JPH0371824A | 1991-03-27 | |||
| DE3422074A1 | 1986-01-23 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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