BONDING METHOD AND APPARATUS

WIPO Patent Application WO/2023/108596

A1

A method and an apparatus for bonding a first object with a second object are provided, the first object being elongated, the second object being defined with a cavity configured to receive at least a length (L) of the first object, the cavity having a receiving capacity which is slightly greater than a volume of the first object to be inserted into the cavity, and the cavity being configured to include a closed end (21a) and an opposite open end (21b). The method comprising: determining an amount of liquid adhesive (31) to be supplied into the cavity on the basis of the difference between the receiving capacity of the cavity and the volume of the first object to be inserted into the cavity; placing the second object in such a way that the closed end (21a) is on bottom and the open end (21b) is on top; supplying the determined amount of liquid adhesive (31) into the cavity in such a way that the supplied liquid adhesive (31) is collected at the closed end (21a); inserting the first object into the cavity via the open end (21b) in such a way that one end of the first object approaches or contacts the closed end (21a); and curing the liquid adhesive (31).

LIN WEIJIA (CN)
SHENG YAN (CN)

PCT/CN2021/139043

June 22, 2023

December 17, 2021

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HENKEL AG & CO KGAA (DE)
HENKEL LOCTITE CHINA CO LTD (CN)

B29C65/48; B29C65/00; B29C65/52; B29C65/54; F16B11/00

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DE102013011421A1	2014-04-03
US20060133086A1	2006-06-22
CN109317361A	2019-02-12
DE102014218337A1	2016-03-17
JP2020023063A	2020-02-13

NTD PATENT & TRADEMARK AGENCY LIMITED (CN)

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