Title:
BONDING METHOD AND BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/021251
Kind Code:
A1
Abstract:
[Problem] To provide a wire bonding method and wire bonding device whereby a free air ball with a large ball diameter can be formed stably while suppressing the oxidation of the free air ball.
[Solution] In addition to the supply of anti-oxidation gas from a gas supply means (10) into an insertion portion (32), anti-oxidation gas is supplied via a gas supply nozzle (40) disposed outside the insertion portion (32) so as to cover an entry of the insertion portion (32), and a spark discharge is caused with the tip of a wire (74) positioned inside the insertion portion (32) and with the tip of a capillary (3) positioned outside the insertion portion (32), whereby a free air ball (75) having a large ball diameter can be formed stably while oxidation of the free air ball (75) is suppressed.
Inventors:
YOSHIDA HIKARU (JP)
SHIROTO MIZUHO (JP)
SHIROTO MIZUHO (JP)
Application Number:
PCT/JP2015/062810
Publication Date:
February 11, 2016
Filing Date:
April 28, 2015
Export Citation:
Assignee:
KAIJO KK (JP)
International Classes:
H01L21/60
Foreign References:
| JPS5974640A | 1984-04-27 | |||
| JPS5994837A | 1984-05-31 | |||
| JP2009105114A | 2009-05-14 | |||
| JP2013058716A | 2013-03-28 | |||
| JP2011040635A | 2011-02-24 |
Attorney, Agent or Firm:
SASAGAWA TAKU (JP)
Hiroshi Sasagawa (JP)
Hiroshi Sasagawa (JP)
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