Title:
BONDING METHOD AND BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/019323
Kind Code:
A1
Abstract:
Provided are a bonding method and the like that are suitable for forming a bond more easily than doing so by the sole means of diffusion or the like. A first bonding member 11 has interference parts 13 that interference with protruding parts 18, and therefore does not fit into a bonding space 16 of a second bonding member 15. A bonding processing unit 3 of a bonding device 1 applies sonic vibration and/or ultrasonic vibration to the first bonding member 11. The first bonding member 11 undergoes sympathetic vibration and expands and contracts, and fits into the bonding space 16 of the second bonding member, and a bonding process is carried out in the fitted state. Thus, the present invention can be used in conjunction with a mechanical bonding process.
Inventors:
SATO SHIGERU (JP)
Application Number:
PCT/JP2021/027262
Publication Date:
January 27, 2022
Filing Date:
July 21, 2021
Export Citation:
Assignee:
SATO SHIGERU (JP)
International Classes:
B23K20/10
Foreign References:
| JPS62224711A | 1987-10-02 | |||
| JP2018522765A | 2018-08-16 | |||
| CN108161214A | 2018-06-15 |
Attorney, Agent or Firm:
HADATE Shoji (JP)
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