Title:
BONDING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/132953
Kind Code:
A1
Abstract:
Provided is a bonding method which can bond a first metal member (1) and a second metal member (2) whilst ensuring sufficient bond strength, and which can suppress and prevent the oozing out of a bonding material during a stage such as repeated reflow during temperature-hierarchical bonding. When a first metal member (11a) made from a first metal and a second metal member (11b) made from a second metal are bonded by means of a bonding material (10) including a low melting point metal having a lower melting point than the first and/or second metals, the low melting point metal constituting the bonding material is Sn or an alloy containing Sn, at least one of the first and second metals is a metal or an alloy which forms an intermetallic compound (12) with the low melting point metal constituting the bonding material, and heat treatment is carried out at the temperature at which the low melting point metal melts, with the bonding material being disposed between the first metal member and the second metal member.
Inventors:
NAKANO KOSUKE (JP)
TAKAOKA HIDEKIYO (JP)
TAKAOKA HIDEKIYO (JP)
Application Number:
PCT/JP2013/053026
Publication Date:
September 12, 2013
Filing Date:
February 08, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B23K1/00; B23K1/19; H01L21/52; H01L21/60; H05K3/34; B23K35/26; B23K101/40; C22C9/00; C22C9/01; C22C13/00; C22C13/02
Foreign References:
| JP2010179336A | 2010-08-19 | |||
| JP2003332731A | 2003-11-21 |
Attorney, Agent or Firm:
NISHIZAWA, HITOSHI (JP)
Hitoshi Nishizawa (JP)
Hitoshi Nishizawa (JP)
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Claims:
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