BONDING METHOD, METHOD FOR MANUFACTURING STRUCTURE, AND STRUCTURE

Title:

BONDING METHOD, METHOD FOR MANUFACTURING STRUCTURE, AND STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2016/002255

Kind Code:

A1

Abstract:

Provided is a bonding method (S1) whereby, even in a case where a thin film (12) comprising gold is formed on the surface of a first member (11), a strong bonding force can be obtained without requiring any special treatment on a second member (14). The thin film (12) comprising gold is formed on the surface of the first member (11), said first member (11) comprising a material other than gold. The bonding method (S1) comprises: an irradiation step (S11) for irradiating laser beam at least to a part of a specific area (12a) of the surface of the first member (11) to thereby expose the base of the thin film (12) at least in a part of the specific area (12a); and a bonding step (S12) for bonding the second member (14) to the specific area (12a) using an adhesive (13).

Inventors:

KUMETA SHOHEI (JP)
YOSHINO GENTO (JP)
KASAI YOHEI (JP)
SAKAMOTO AKIRA (JP)

Application Number:

PCT/JP2015/056140

Publication Date:

January 07, 2016

Filing Date:

March 03, 2015

Export Citation:

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Assignee:

FUJIKURA LTD (JP)

International Classes:

C09J5/02; B32B15/04; C09J201/00

Foreign References:

JP2002084159A	2002-03-22
JPS6473750A	1989-03-20
JP2000357936A	2000-12-26
JP2014012284A	2014-01-23
JP2007167936A	2007-07-05
JP2006316290A	2006-11-24
JP2001284676A	2001-10-12

Other References: