Title:
BONDING METHOD AND BONDING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/090502
Kind Code:
A1
Abstract:
Provided is a bonding method for bonding adherends to each other via an adhesive. The adherends and the adhesive contain a thermosetting resin. The method includes a step for molding the adherends, a step for positioning the adhesive between the adherends, and a step for curing the adhesive, bonding the adherends to each other, and forming a bonding structure. In the step for molding the adherends, a reinforcing member having higher rigidity than the adherends is positioned and integrally molded on the surfaces of the adherends on which the adhesive will be positioned.
Inventors:
TAKAGI KIYOKA (JP)
ARAI KEIJI (JP)
KATSUMATA SHINGO (JP)
HASEGAWA KOICHI (JP)
ARAI KEIJI (JP)
KATSUMATA SHINGO (JP)
HASEGAWA KOICHI (JP)
Application Number:
PCT/JP2023/038620
Publication Date:
May 02, 2024
Filing Date:
October 26, 2023
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C65/48; B32B3/08; B32B27/04; B32B27/12; B29L9/00
Foreign References:
| JP2016501145A | 2016-01-18 | |||
| JP2005246771A | 2005-09-15 | |||
| JP2015504799A | 2015-02-16 | |||
| JP2019098704A | 2019-06-24 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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