Title:
BONDING STRUCTURE FOR METAL PLATE
Document Type and Number:
WIPO Patent Application WO/2008/023448
Kind Code:
A1
Abstract:
Provided is a bonding structure for a metal plate, cracking of the plate is hardly
caused even when a bonding position is set on a portion where a tensile stress is
concentrated. Laminated metal plates are blanked together toward the lower
surface sides thereof and formed into a tongue piece shape. The depth of blanking
is made to be equal to or more than the total of the laminated metal plates. Tongue
piece parts (8) are blanked in a cantilever shape with a bonded center part (3)
side being left. The tongue piece parts (8) are so bent in the outer and lower direction
at the connection portions thereof with the bonded center part (3) that the intermediate
positions of the tongue piece parts (8) in the extending direction are parallel
with the folding lines (7) of the connection parts. The width of each of the tongue
piece parts (8) is so set as to gradually increase toward its tip end.
Inventors:
UETA KOSAKU (JP)
Application Number:
PCT/JP2006/325173
Publication Date:
February 28, 2008
Filing Date:
December 18, 2006
Export Citation:
Assignee:
NIHON METAL GASKET (JP)
UETA KOSAKU (JP)
UETA KOSAKU (JP)
International Classes:
B21D39/03; F16B5/00; F16J15/08
Foreign References:
| JPS56123775U | 1981-09-21 | |||
| JP2002364685A | 2002-12-18 | |||
| JPH09141351A | 1997-06-03 | |||
| JPH11165448A | 1999-06-22 |
Attorney, Agent or Firm:
MORI, Tetsuya et al. (Yusen Iwamotocho Bldg. 8th Floor3-3, Iwamoto-cho 2-chome,Chiyoda-k, Tokyo 32, JP)
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