Title:
BONDING STRUCTURE, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/082602
Kind Code:
A1
Abstract:
The present invention relates to a bonding structure and the like that facilitate characteristic impedance matching between a metal terminal and a line conductor. According to the present invention, a bonding structure C includes: a metal terminal 1 having an end surface 1a; a line conductor 2 having a side surface 2a which a portion of the end face 1a of the metal terminal 1 faces; and a metal particle. The bonding structure is located so as to cover an area from a first end portion 1b including the end face 1a of the metal terminal 1 to a second end portion 2b including the side surface 2a of the line conductor 2, and is provided with a bonding material 3 bonded to the metal terminal 1 and the line conductor 2.
Inventors:
MORI RYUUJI (JP)
TANIGUCHI MASAHIKO (JP)
TANIGUCHI MASAHIKO (JP)
Application Number:
PCT/JP2018/036560
Publication Date:
May 02, 2019
Filing Date:
September 28, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12
Foreign References:
| JP2009077365A | 2009-04-09 | |||
| JP2011061750A | 2011-03-24 |
Attorney, Agent or Firm:
SAIKYO, Keiichiro (JP)
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