Title:
BONDING WIRE FOR LIGHT-EMITTING DIODE (LED) AND MANUFACTURING METHOD FOR BONDING WIRE FOR LED
Document Type and Number:
WIPO Patent Application WO/2024/014268
Kind Code:
A1
Abstract:
Provided are: a silver alloy bonding wire for an LED, the bonding wire realizing high reflectance in relation to blue light and having improved high-temperature strength in a ball neck portion even in ultra-low-loop-shaped bonding; and a manufacturing method thereof. A bonding wire for a light-emitting diode (LED) according to an embodiment is formed of a silver alloy containing silver at 98 mass% or greater and has a high-temperature/normal-temperature strength ratio from 0.6 to 0.99 and a high-temperature elongation percentage of 1.5% or greater.
Inventors:
ANTOKU YUKI (JP)
HONDA RINA (JP)
HONDA RINA (JP)
Application Number:
PCT/JP2023/023569
Publication Date:
January 18, 2024
Filing Date:
June 26, 2023
Export Citation:
Assignee:
TANAKA ELECTRONICS IND (JP)
International Classes:
C22C5/06; H01L21/60; C22F1/00; C22F1/14; H01L33/62
Foreign References:
| JP2002359261A | 2002-12-13 | |||
| JP2014096403A | 2014-05-22 | |||
| JP2016025114A | 2016-02-08 | |||
| JP2013135042A | 2013-07-08 | |||
| JP2003059964A | 2003-02-28 | |||
| JP2003023030A | 2003-01-24 |
Attorney, Agent or Firm:
KOBAYASHI TAKUMI (JP)
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