Title:
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/270077
Kind Code:
A1
Abstract:
Provided is a novel Cu bonding wire that produces a good FAB shape, and that suppresses galvanic corrosion in a high-temperature environment and produces good bonding reliability in a 2nd junction. This bonding wire for a semiconductor device is characterized by including a core comprising Cu or a Cu alloy and a coating layer containing an electroconductive metal other than Cu formed on the surface of the core, the coating layer having a region having Pd as a main component on the core side in the thickness direction of the coating layer, and having a region including Ni and Pd in a depth range of 0.5d from the wire surface, where d (nm) is the thickness of the coating layer, the thickness d of the coating layer being 10-130 nm, the ratio CNi/CPd of the concentration CNi (mass%) of Ni and the concentration CPd (mass%) of Pd with respect to the wire overall being 0.02-0.7, the position of maximum concentration of Ni in the concentration profile in the depth direction of the wire being in a depth range of 0.5d from the wire surface, and the maximum concentration of Ni being 10 at% or greater.
Inventors:
ODA DAIZO (JP)
ETO MOTOKI (JP)
YAMADA TAKASHI (JP)
HAIBARA TERUO (JP)
OISHI RYO (JP)
ETO MOTOKI (JP)
YAMADA TAKASHI (JP)
HAIBARA TERUO (JP)
OISHI RYO (JP)
Application Number:
PCT/JP2022/013461
Publication Date:
December 29, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
NIPPON MICROMETAL CORP (JP)
International Classes:
C22C9/00; H01L21/60
Domestic Patent References:
| WO2019031498A1 | 2019-02-14 | |||
| WO2015163297A1 | 2015-10-29 | |||
| WO2020246094A1 | 2020-12-10 | |||
| WO2016204138A1 | 2016-12-22 | |||
| WO2021193378A1 | 2021-09-30 | |||
| WO2017221770A1 | 2017-12-28 | |||
| WO2017013796A1 | 2017-01-26 |
Foreign References:
| JP2006190763A | 2006-07-20 | |||
| JP2015119004A | 2015-06-25 | |||
| JP2017092078A | 2017-05-25 | |||
| JPS6148543A | 1986-03-10 | |||
| JP2018503743A | 2018-02-08 | |||
| JP2005167020A | 2005-06-23 | |||
| JP2020150116A | 2020-09-17 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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