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Title:
BONDING WIRE
Document Type and Number:
WIPO Patent Application WO/2019/151130
Kind Code:
A1
Abstract:
Provided is a bonding wire that has high bonding reliability over a long period of time and that makes it possible to suppress the generation of cracks and Kirkendall's voids in the bonding portion between the bonding wire and an electrode even in the case of bonding to an electrode made of an Al alloy. The content of Cu is 0.1 mass% to 5.0 mass%, the content of Ca is 1 mass ppm to 100 mass ppm, the total content of one or two or more elements selected from the group consisting of Nd, Sm, and Gd is 1 mass ppm to 100 mass ppm, the total content of the Ca content and the content of one or two or more elements selected from the group consisting of and Nd, Sm, and Gd is 5 mass ppm to 150 mass ppm, and the remainder is Au.

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Inventors:
KUROSAKI YUJI (JP)
TANAHASHI AKIRA (JP)
Application Number:
PCT/JP2019/002449
Publication Date:
August 08, 2019
Filing Date:
January 25, 2019
Export Citation:
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Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H01L21/60; C22C5/02; C22F1/00; C22F1/14
Domestic Patent References:
WO2012169067A12012-12-13
Foreign References:
JP2003133362A2003-05-09
JP2004031469A2004-01-29
Attorney, Agent or Firm:
TSUTADA, Masato et al. (JP)
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