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Title:
BOOKBINDING SYSTEM USING ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2008/032419
Kind Code:
A1
Abstract:
A novel bookbinding system, and bookbinding method, solving various problems attributed to the use of stapler needle. There is provided a bookbinding system, and bookbinding method, comprising, with respect to a book produced through application of an adhesive to printed sheets, sheet folding and cutting, making perforations for adhesive penetration along a fold line on the stitch side thereof, carrying out adhesive application on a line or in dots, and performing sheet folding and stitching.

More Like This:
JP2001199178PASTE PRESSURIZING DEVICE IN BOOKBINDING MACHINE, BOOKBINDING MACHINE AND IMAGE FORMING DEVICE
Inventors:
OYAMA YOSHIO (JP)
Application Number:
PCT/JP2006/319319
Publication Date:
March 20, 2008
Filing Date:
September 28, 2006
Export Citation:
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Assignee:
SANYO ARCH CO LTD (JP)
OYAMA YOSHIO (JP)
International Classes:
B42C9/00
Foreign References:
JP2000043445A2000-02-15
JP2003220774A2003-08-05
JP2005041099A2005-02-17
JP2001260565A2001-09-25
Attorney, Agent or Firm:
TAKAHASHI, Toshihiro (No. 301 Ogikubo Sunny Garden,,4-28-9, Ogikubo, Suginami-ku, Tokyo51, JP)
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