Title:
BORON NITRIDE MATERIAL AND APPLICATION OF SAME
Document Type and Number:
WIPO Patent Application WO/2024/004526
Kind Code:
A1
Abstract:
A boron nitride material (10) according to the present disclosure comprises: a hexagonal boron nitride which has a thickness of 5 nm or more in the c-axis direction; and a polymer (2) which adheres to the hexagonal boron nitride. The solubility parameter of the boron nitride material 10 as determined by a methanol titration method is less than 47.9 MPa0.5. A boron nitride material (10) according to the present disclosure is used in applications such as a filler, a resin composition, a prepreg, a film with a resin, a metal foil with a resin, a metal-clad laminate and a wiring board.
Inventors:
INOBE HONAMI
SAITO TERUHIKO
HOSOKAWA TEPPEI
AITA KAZUKI
SAITO TERUHIKO
HOSOKAWA TEPPEI
AITA KAZUKI
Application Number:
PCT/JP2023/020740
Publication Date:
January 04, 2024
Filing Date:
June 05, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C01B21/064; B32B9/00; B32B15/08; C08J5/10; C08K3/38; C08L39/04; C08L65/00; C08L71/12; C08L101/00; H05K1/03
Domestic Patent References:
| WO2017163674A1 | 2017-09-28 | |||
| WO2017195902A1 | 2017-11-16 |
Foreign References:
| JP2006257392A | 2006-09-28 | |||
| JP2019527280A | 2019-09-26 | |||
| US20180337359A1 | 2018-11-22 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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