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Patent Searching and Data


Title:
BORON NITRIDE PARTICLES AND HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2023/127742
Kind Code:
A1
Abstract:
The boron nitride particles according to the present invention each have a section having streak voids. This heat dissipation sheet is one obtained by shaping a thermally conductive resin composition comprising the boron nitride particles and a resin. The present invention can provide boron nitride particles having a low void content and a heat dissipation sheet containing said boron nitride particles.

Inventors:
SASAKI YUSUKE (JP)
MIYATA KENJI (JP)
NAKASHIMA MICHIHARU (JP)
Application Number:
PCT/JP2022/047691
Publication Date:
July 06, 2023
Filing Date:
December 23, 2022
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C01B21/064; C08K3/38; C08L101/00
Domestic Patent References:
WO2020004600A12020-01-02
WO2018066277A12018-04-12
WO2018139642A12018-08-02
WO2020194867A12020-10-01
Foreign References:
JP2018020932A2018-02-08
JP2018104260A2018-07-05
JP2018145090A2018-09-20
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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