Title:
BRUSH DETECTION DEVICE AND PRESSURE CONTROL METHOD FOR SEMICONDUCTOR WAFER CLEANING EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2023/243927
Kind Code:
A1
Abstract:
The present invention relates to a brush detection device and a pressure control method for semiconductor wafer cleaning equipment, whereby a brush cleaning process is controlled while monitoring the position and initial load of a brush when cleaning a wafer substrate. The present invention provides a novel brush detection device and pressure control method for semiconductor wafer cleaning equipment, wherein a combination of a load cell and a moving coil are used to control the overall operation of a brush by, for example, controlling brush pressure and position, during a cleaning process for removing impurities from the surface of a wafer substrate, and brush soft landing technology minimizing the impact of contact with the wafer substrate is employed. The brush detection device and the pressure control method make it possible to smoothly perform a cleaning process on the wafer substrate and improve the efficiency of the cleaning process by shortening the process time, and can protect the wafer substrate against the risk of damage and ensure the quality of the cleaning of the wafer substrate.
Inventors:
KIM TEA KYONG (KR)
Application Number:
PCT/KR2023/007801
Publication Date:
December 21, 2023
Filing Date:
June 08, 2023
Export Citation:
Assignee:
NCKT CO LTD (KR)
International Classes:
H01L21/67; B05B7/04; B05C11/10; B08B1/00; H01L21/02
Foreign References:
| KR20170063691A | 2017-06-08 | |||
| JP4555843B2 | 2010-10-06 | |||
| KR20170110008A | 2017-10-10 | |||
| KR20060037649A | 2006-05-03 | |||
| KR20010111979A | 2001-12-20 | |||
| KR102489796B1 | 2023-01-18 |
Attorney, Agent or Firm:
KIM, Jeong Hyeon (KR)
Download PDF: