BUILT-IN MULTILAYER RESIN SUBSTRATE INSIDE MAGNETIC CORE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE

Title:

BUILT-IN MULTILAYER RESIN SUBSTRATE INSIDE MAGNETIC CORE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2014/115454

Kind Code:

A1

Abstract:

An antenna device (101) is equipped with a multilayer resin substrate obtained by layering a plurality of resin sheets (11-15), and a coil conductor formed on the multilayer resin substrate. A plurality of coil-conductor striations (21) are formed on the underside of the resin sheet (12). When temporarily pressure-bonding a magnetic core (40) to the resin sheet (12), the magnetic core (40) splits along the striations (21), resulting in the formation of cracks (CR). In this manner, the antenna device (101) is configured by layering another resin sheet and the resin sheet (12), to which the magnetic core (40) having cracks (CR) formed therein is bonded, and then subjecting the same to a main pressure-bonding.

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Inventors:

YOSUI KUNIAKI (JP)
GOUCHI NAOKI (JP)

Application Number:

PCT/JP2013/084193

Publication Date:

July 31, 2014

Filing Date:

December 20, 2013

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)

International Classes:

H05K3/46; H01Q7/06

Foreign References:

JP4218635B2	2009-02-04
JP2010123879A	2010-06-03
JP2009130446A	2009-06-11

Attorney, Agent or Firm:

Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)

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