Title:
BULK ACOUSTIC RESONATOR ASSEMBLY, MANUFACTURING METHOD, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/267710
Kind Code:
A1
Abstract:
Disclosed are a bulk acoustic resonator assembly, a manufacturing method, and a communication device. The bulk acoustic resonator assembly comprises: a substrate; and at least one resonance unit, the resonance unit being located on a surface of the substrate, the size of the resonance unit in a direction perpendicular to the thickness direction of the substrate being smaller than the size of the resonance unit in a direction parallel to the thickness direction of the substrate, and in the direction perpendicular to the thickness direction of the substrate, the resonance unit comprising a laminated structure of a first electrode, a piezoelectric layer, and a second electrode. According to the technical solution provided in embodiments of the present invention, the sizes of the bulk acoustic resonator assembly and the communication device in the direction perpendicular to the thickness direction of the substrate are reduced.
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Inventors:
DING YANKUN (CN)
YANG QINGHUA (CN)
TANG ZHAOYUN (CN)
LAI ZHIGUO (CN)
YANG QINGHUA (CN)
TANG ZHAOYUN (CN)
LAI ZHIGUO (CN)
Application Number:
PCT/CN2022/091455
Publication Date:
December 29, 2022
Filing Date:
May 07, 2022
Export Citation:
Assignee:
SUZHOU HUNTERSUN ELECTRONICS CO LTD (CN)
International Classes:
H03H9/02
Domestic Patent References:
| WO2019201521A1 | 2019-10-24 |
Foreign References:
| CN113659953A | 2021-11-16 | |||
| CN113258900A | 2021-08-13 | |||
| US20140246956A1 | 2014-09-04 | |||
| US20140292155A1 | 2014-10-02 | |||
| JP2001044794A | 2001-02-16 | |||
| US20060066175A1 | 2006-03-30 | |||
| US20030112097A1 | 2003-06-19 | |||
| CN111669141A | 2020-09-15 | |||
| CN111555728A | 2020-08-18 |
Attorney, Agent or Firm:
FAIRSKY LAW OFFICE (CN)
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