Title:
BULK ACOUSTIC RESONATOR HAVING VOIDED LAYER, AND ASSEMBLY, MANUFACTURING METHOD, FILTER AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/062911
Kind Code:
A1
Abstract:
The present disclosure relates to a bulk acoustic resonator, comprising: a substrate, an acoustic mirror, a bottom electrode, a piezoelectric layer and a top electrode, wherein an overlapping region of the top electrode, the piezoelectric layer and the bottom electrode in a thickness direction of the resonator forms an effective region of the resonator; the piezoelectric layer comprises a first layer and a second layer; a voided layer is provided between the first layer and the second layer; the second layer is located above the first layer; an inner edge of the voided layer is located on an inner side of a boundary of the effective region in a horizontal direction; an outer edge of the voided layer is located inside the piezoelectric layer and is defined by the piezoelectric layer; and the second layer is not provided with a specific release path that extends in a thickness direction of the second layer, passes through the second layer and is in direct communication with the voided layer. The present disclosure also relates to a bulk acoustic resonator assembly, a manufacturing method for a bulk acoustic resonator, and a filter and an electronic device.
Inventors:
PANG WEI (CN)
BAN SHENGGUANG (CN)
XU YANG (CN)
YANG QINGRUI (CN)
ZHANG MENGLUN (CN)
BAN SHENGGUANG (CN)
XU YANG (CN)
YANG QINGRUI (CN)
ZHANG MENGLUN (CN)
Application Number:
PCT/CN2021/117478
Publication Date:
March 31, 2022
Filing Date:
September 09, 2021
Export Citation:
Assignee:
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
International Classes:
H03H3/02
Foreign References:
| CN111010104A | 2020-04-14 | |||
| CN111010133A | 2020-04-14 | |||
| CN111245393A | 2020-06-05 | |||
| CN111010135A | 2020-04-14 | |||
| CN107453729A | 2017-12-08 |
Attorney, Agent or Firm:
BEIJING JINCHENG TONGDA & NEAL LAW FIRM (CN)
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