Title:
BULK ACOUSTIC RESONATOR AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/044874
Kind Code:
A1
Abstract:
The present disclosure relates to the technical field of communications, and provides a bulk acoustic resonator and a manufacturing method therefor, and an electronic device. The bulk acoustic resonator of the present disclosure comprises: a first base substrate, a first electrode, a piezoelectric layer, and a second electrode; the first electrode is provided on the first base substrate, the piezoelectric layer is provided on the side of the first electrode facing away from the first base substrate, and the second electrode is provided on the side of the piezoelectric layer facing away from the first electrode; a functional layer is provided on the side of the piezoelectric layer close to the first base substrate, and/or on the side of the piezoelectric layer facing away from the first base substrate; the material of the functional layer comprises a conductive material, and the functional layer is configured to suppress the temperature drift of the bulk acoustic resonator.
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Inventors:
WANG XIYUAN (CN)
Application Number:
PCT/CN2022/115414
Publication Date:
March 07, 2024
Filing Date:
August 29, 2022
Export Citation:
Assignee:
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)
BOE TECHNOLOGY GROUP CO LTD (CN)
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H03H9/17; H03H9/15
Foreign References:
| JP2008219237A | 2008-09-18 | |||
| CN102904546A | 2013-01-30 | |||
| US20140292153A1 | 2014-10-02 | |||
| JP2018110317A | 2018-07-12 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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