Title:
BULK ACOUSTIC WAVE RESONANT STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/174587
Kind Code:
A1
Abstract:
Disclosed in embodiments of the present application are a bulk acoustic wave resonant structure and a manufacturing method therefor. The bulk acoustic wave resonant structure comprises a substrate, and a reflection structure, a first electrode layer, a piezoelectric layer and a second electrode layer, which are sequentially stacked on the substrate, wherein ring-shaped grooves are provided in the piezoelectric layer; and the grooves are located in an active area and are close to an edge of the active area.
Inventors:
ZHANG DAPENG (CN)
KOH ZHIWEI (CN)
LIN RE-CHING (CN)
DUAN ZHI (CN)
KOH ZHIWEI (CN)
LIN RE-CHING (CN)
DUAN ZHI (CN)
Application Number:
PCT/CN2021/120744
Publication Date:
August 25, 2022
Filing Date:
September 26, 2021
Export Citation:
Assignee:
WUHAN YANXI MICRO COMPONENTS CO LTD (CN)
International Classes:
H03H9/17; H03H3/02
Foreign References:
| CN112003581A | 2020-11-27 | |||
| CN107733396A | 2018-02-23 | |||
| CN112165310A | 2021-01-01 | |||
| CN112332793A | 2021-02-05 | |||
| CN108233889A | 2018-06-29 | |||
| CN109546985A | 2019-03-29 | |||
| US20120182090A1 | 2012-07-19 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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