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Patent Searching and Data


Title:
BULK ACOUSTIC WAVE RESONATOR AND FABRICATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/213333
Kind Code:
A1
Abstract:
A BAW resonator, comprising: a piezoelectric film array, comprising a plurality of piezoelectric films between a substrate and a cap layer, wherein a plurality of first cavities are provided in the vertical direction between adjacent piezoelectric films, between the piezoelectric films and the cap layer, and between the piezoelectric films and the substrate, a shared second cavity is provided between adjacent piezoelectric films in a horizontal first direction, and a shared third cavity is provided between adjacent piezoelectric films in a horizontal second direction; a plurality of electrode layers, which cover at least the top surface and bottom surface of each piezoelectric film; and a plurality of electrode interconnection layers, which connect the electrode layers at the bottom surfaces of the piezoelectric films along the side surface of the third cavity.

Inventors:
WU MING (CN)
TANG ZHAOYUN (CN)
YANG QINGHUA (CN)
LAI ZHIGUO (CN)
WANG JIAYOU (CN)
Application Number:
PCT/CN2021/088160
Publication Date:
October 28, 2021
Filing Date:
April 19, 2021
Export Citation:
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Assignee:
SUZHOU HUNTERSUN ELECTRONICS CO LTD (CN)
International Classes:
H03H3/02; H03H9/02; H03H9/205
Foreign References:
CN111446940A2020-07-24
CN111564467A2020-08-21
CN111510096A2020-08-07
CN101009482A2007-08-01
US20190267536A12019-08-29
CN110266285A2019-09-20
US20190372543A12019-12-05
CN110798160A2020-02-14
US20180367113A12018-12-20
Attorney, Agent or Firm:
FAIRSKY LAW OFFICE (CN)
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