Title:
BULK ACOUSTIC WAVE RESONATOR, METHOD FOR PREPARING BULK ACOUSTIC WAVE RESONATOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/202548
Kind Code:
A9
Abstract:
The present disclosure belongs to the technical field of bulk acoustic wave resonators. Provided are a bulk acoustic wave resonator, a method for preparing a bulk acoustic wave resonator, and an electronic device. The bulk acoustic wave resonator comprises a first substrate, a first electrode, a piezoelectric layer, a second electrode and a temperature compensation layer, wherein the first substrate is provided with a first groove; the second electrode, the piezoelectric layer and the first electrode are sequentially arranged along a side that faces away from the first substrate; an opening of the first groove faces the second electrode, and an orthographic projection of the first groove on the piezoelectric layer covers an orthographic projection of the second electrode on the piezoelectric layer; orthographic projections of the first electrode and the second electrode on the piezoelectric layer at least partially overlap; the temperature compensation layer is arranged on the side of the first electrode close to the first substrate, and is in contact with the piezoelectric layer; and the side of the first electrode that faces away from the first substrate is provided with at least one stepped structure, the stepped structure comprises a protruding structure and a second groove, which is arranged on the side of the protruding structure close to the central area of the first electrode, and the second groove and the protruding structure are both annular.
Inventors:
JIAO ZHUOFAN (CN)
Application Number:
PCT/CN2023/088850
Publication Date:
January 11, 2024
Filing Date:
April 18, 2023
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H03H9/02; H03H9/17
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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