BULK THERMOELECTRIC DEVICE PREPARATION METHOD

Title:

BULK THERMOELECTRIC DEVICE PREPARATION METHOD

Document Type and Number:

WIPO Patent Application WO/2020/075890

Kind Code:

A1

Abstract:

The present invention relates to a bulk thermoelectric device preparation method enabling a simplified manufacturing process as well as reduction of manufacturing cost. The present invention comprises the steps of: preparing two types of substrates (P-type and N-type) by slicing a material for a thermoelectric device; forming a P/N layer, which has intersecting P-type pellets and N-type pellets, by attaching the P-type pellets formed on the P-type substrate and the N-type pellets formed on the N-type substrate so as to be alternately interlocked, and then polishing (grinding) the lower part of each substrate; and preparing the thermoelectric device by assembling ceramic substrates, on which a conductive electrode pad is formed, on the upper part and the lower part of the P/N layer.

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Inventors:

CHA JIN WHAN (KR)

Application Number:

PCT/KR2018/012027

Publication Date:

April 16, 2020

Filing Date:

October 12, 2018

Export Citation:

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Assignee:

HUMOTT CO LTD (KR)

International Classes:

H01L35/34; H01L35/32

Foreign References:

KR19990077112A	1999-10-25
JP2001119077A	2001-04-27
JP2004296960A	2004-10-21
KR20170091386A	2017-08-09
JP2001274466A	2001-10-05
KR20180120192A	2018-11-05

Other References: