Title:
BUMP ELECTRODE INSPECTION METHOD AND BUMP ELECTRODE INSPECTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2012/140925
Kind Code:
A1
Abstract:
The present invention comprises the following steps: a first measurement step for measuring electrical properties of an object to be inspected (10) in a state where the object to be inspected (10) is pressed against an inspection circuit substrate (110) having a contact constituted by a metal projection that comes into contact with a bump electrode (12); and, following the first measurement step, a second measurement step for re-measuring the electrical properties of the object to be inspected (10) in a state where the object to be inspected (10) is pressed against the inspection circuit substrate (110) having the contact constituted by the metal projection that comes into contact with the bump electrode (12). A first contact region of the bump electrode (12), which is a region that comes into contact with the contact in the first measurement step, and a second contact region of the bump electrode (12) which is a region that comes into contact with the contact in the second measurement step, are configured so that the two regions do not overlap at least partially.
Inventors:
NAKAMURA TAKUYA (JP)
Application Number:
PCT/JP2012/050832
Publication Date:
October 18, 2012
Filing Date:
January 17, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
NAKAMURA TAKUYA (JP)
NAKAMURA TAKUYA (JP)
International Classes:
H01L21/60; G01R31/26
Foreign References:
| JP2006292456A | 2006-10-26 | |||
| JP2009289767A | 2009-12-10 | |||
| JP2001108706A | 2001-04-20 | |||
| JP2006098253A | 2006-04-13 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
Download PDF:
Claims: