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Title:
BUSBAR ASSEMBLY AND METHOD FOR MANUFACTURING BUSBAR ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2020/262030
Kind Code:
A1
Abstract:
Busbar assembly (1), (2) according to the present invention is provided with: a plurality of busbars (10a, 10b) arranged in parallel with a gap (19) therebetween in the same plane; and an insulative resin layer (30) that includes a gap filling part (31) and a first surface-side laminate part (40), wherein the first surface-side laminate part (40) has provided thereto a plurality of first surface-side center openings (41a, 41b) that expose prescribed portions in first surfaces (11) of the plurality of busbars and form a plurality of exposure regions, and the insulative resin layer (30) is formed from an insulative resin material (240) which is transparent in a semi-cured state and is nontransparent in a completely cured state.

Inventors:
TATSUMI SHOTA (JP)
Application Number:
PCT/JP2020/023142
Publication Date:
December 30, 2020
Filing Date:
June 12, 2020
Export Citation:
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Assignee:
SUNCALL CORP (JP)
International Classes:
H01B13/00; H01B7/00
Domestic Patent References:
WO2019044687A12019-03-07
WO2019049537A12019-03-14
Foreign References:
JPH06251637A1994-09-09
JP2011159337A2011-08-18
Attorney, Agent or Firm:
ARAWORE INTERNATIONAL IP LAW FIRM (JP)
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