Title:
BUTTONLESS TOUCH SENSOR MODULE ASSEMBLY AND METHOD OF ASSEMBLING SAME
Document Type and Number:
WIPO Patent Application WO/2021/100973
Kind Code:
A1
Abstract:
According to the present invention, disclosed is a buttonless touch sensor module assembly which is mounted on a mobile device (300) and outputs a detection signal in response to a user's touch operation, the buttonless touch sensor module assembly comprising: a sensor PCB (110) which has one or more sensor elements (111) for detecting the user's touch operation mounted on one side thereof, and which is signal-connected to a device PCB (310) of the mobile device (300) and outputs a detection signal of a sensor element (111); a support member (120) that has one side attached to one side of the sensor PCB (110) and has a sensor insertion hole (121) for inserting the sensor element (111), the sensor insertion hole (121) being formed open at a position corresponding to the sensor element (111); and a fixing member (130) that has one side attached to the other side of the support member (120) and the other side attached to an inner surface of a frame (320) of the mobile device (300).
Inventors:
KWON HYOUK IL (KR)
BAEK SEUNG HYUN (KR)
BAEK SEUNG HYUN (KR)
Application Number:
PCT/KR2020/002169
Publication Date:
May 27, 2021
Filing Date:
February 14, 2020
Export Citation:
Assignee:
TACHYON CO LTD (KR)
International Classes:
H04M1/02
Foreign References:
| KR20180059720A | 2018-06-05 | |||
| KR20170085248A | 2017-07-24 | |||
| KR20190121155A | 2019-10-25 | |||
| KR20190004122A | 2019-01-11 | |||
| KR20190078960A | 2019-07-05 |
Attorney, Agent or Firm:
KIM, Young Dae (KR)
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