Title:
CALCULATION DEVICE, AND BENDING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/064701
Kind Code:
A1
Abstract:
The present invention is a calculation device that updates the range of the height to which a bending device moves, said bending device bending a lead wire that is inserted into a through hole of a substrate and projects from the back surface of the substrate, and said calculation device updating the range each time the form of the back surface of a substrate changes. The present invention is also a method for bending a lead wire of a lead component comprising: an insertion step for inserting the lead wire of the lead component into the through hole of the substrate; an updating step that, each time the form of the back surface of the substrate changes, updates the height when there is horizontal-direction movement by the bending device at which there is no interference between the lead wire projecting from the back surface of the substrate due to the insertion step and the bending device that bends the lead wire; and a bending step for moving the bending device below the lead wire to be bent so that the lead wire will be bent at the height updated in the updating step.
Inventors:
ISHIKAWA NOBUYUKI (JP)
Application Number:
PCT/JP2020/036652
Publication Date:
March 31, 2022
Filing Date:
September 28, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2017037895A1 | 2017-03-09 |
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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