Title:
CAMERA MODULE
Document Type and Number:
WIPO Patent Application WO/2021/200554
Kind Code:
A1
Abstract:
A camera module according to one aspect of the present technology is provided with: a first case having an opening at one end; a housing having a second case bonded to the other end of the first case; a lens barrel member that is disposed inside the housing and has a lens barrel part fitting into the opening in an optical axis direction; a sensor substrate that has an imaging element facing the lens barrel part and is disposed inside the housing; a peripheral wall part that has a first end portion supporting the lens barrel member and a second end portion elastically contacting the second case and covers the periphery of the imaging element; and a support body that has a regulation unit disposed between the peripheral wall part and the inner peripheral surface of the first case and regulating the approach of the lens barrel member to the second case and is disposed between the lens barrel member and the second case.
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Inventors:
TOKITO TOSHIHIRO (JP)
Application Number:
PCT/JP2021/012573
Publication Date:
October 07, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G03B17/02; G02B7/02; H04N5/225
Domestic Patent References:
| WO2019049537A1 | 2019-03-14 |
Foreign References:
| JP2013109188A | 2013-06-06 | |||
| JP2018173434A | 2018-11-08 | |||
| JP2018173431A | 2018-11-08 | |||
| JP3178274U | 2012-09-06 | |||
| JP2006327514A | 2006-12-07 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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