Title:
CAPACITIVELY COUPLED PLASMA SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/068698
Kind Code:
A1
Abstract:
A plasma substrate processing apparatus according to one embodiment of the present invention comprises: a process chamber; an upper electrode disposed in the process chamber; a substrate holder disposed under the upper electrode and facing the upper electrode to support a substrate; and an RF power source for applying RF power to the substrate holder. The upper electrode includes: an upper electrode conductive plate having lower surfaces with different heights from the substrate holder according to positions thereof; and a compensating plate coupled to a lower portion of the conductive plate, having a different thickness according to positions thereof to compensate for a height difference according to the positions of the upper electrode conductive plate, and having a dielectric constant. The lower surface of the compensating plate is coplanar.
Inventors:
JEON BUIL (KR)
SHIN TAEHO (KR)
LIM DOOHO (KR)
PARK JUNGSU (KR)
ON BUMSOO (KR)
LEE SEUNGHO (KR)
SHIN TAEHO (KR)
LIM DOOHO (KR)
PARK JUNGSU (KR)
ON BUMSOO (KR)
LEE SEUNGHO (KR)
Application Number:
PCT/KR2022/015714
Publication Date:
April 27, 2023
Filing Date:
October 17, 2022
Export Citation:
Assignee:
INNOVATION FOR CREATIVE DEVICES CO LTD (KR)
International Classes:
H01J37/32
Foreign References:
| KR20150143793A | 2015-12-23 | |||
| KR101094424B1 | 2011-12-15 | |||
| KR100760243B1 | 2007-09-19 | |||
| KR20160099635A | 2016-08-22 | |||
| KR20150032811A | 2015-03-30 | |||
| KR20140028703A | 2014-03-10 | |||
| KR20200083330A | 2020-07-08 | |||
| KR20130035838A | 2013-04-09 |
Attorney, Agent or Firm:
NURY PATENT LAW FIRM (KR)
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