CARD CHIP STRUCTURE OF DOUBLE-CHIP SIM CARD

WIPO Patent Application WO/2023/082477

A1

Provided in the present invention is a card chip structure of a new double-chip SIM card. The card chip structure is composed of two SIM card chips, which are respectively denoted as a main card chip and a secondary card chip. The main card chip and the secondary card chip are connected according to one of the three connection modes provided in the present invention, and are finally packaged in the same SIM card. The main card chip implements all the functions required in an in-service SIM card technical specifications, and the secondary card chip implements additional functions that cannot be realized under the restriction of the in-service SIM card technical specifications. A SIM card, which is obtained by means of packaging by using the card chip structure of the double-chip SIM card, keeps fully compatible with the in-service SIM card packing technical specifications in terms of packaging. The biggest advantages of the card chip structure are: 1) insofar as full compliance with the in-service SIM card technical specifications is realized, additional functions that cannot be realized under the restriction of the in-service SIM card technical specifications can be realized; and 2) the technical threshold and economic threshold for performing new function development on a SIM card are greatly reduced.

HUANG CE (CN)

PCT/CN2022/075434

May 19, 2023

February 08, 2022

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HUANG CE (CN)

H04M1/02; G06K19/077; H04B1/38

CN111160508A	2020-05-15
US6584326B1	2003-06-24
CN101004798A	2007-07-25
CN101398913A	2009-04-01
CN111314078A	2020-06-19
CN111400737A	2020-07-10

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