Title:
CARRIER FOR DOUBLE-SIDED POLISHING, AND SILICON WAFER DOUBLE-SIDED POLISHING METHOD AND DEVICE EMPLOYING SAME
Document Type and Number:
WIPO Patent Application WO/2023/203915
Kind Code:
A1
Abstract:
[Problem] To provide a carrier for double-sided polishing, with which an increase in service life can be achieved by improving wear resistance, and a silicon wafer double-sided polishing method and device employing the same. [Solution] A carrier 10 for double-sided polishing according to the present invention is a member for holding a silicon wafer when performing double-sided polishing of the silicon wafer, and comprises a substantially disk-shaped carrier body comprising a resin laminated plate containing a fiber substrate, and a wafer holding hole 12 formed in the carrier body 11. A fiber exposure rate of a main surface of the carrier body 11 is less than 50%.
Inventors:
TAKUBO SHINYA (JP)
MIKURIYA SHUNSUKE (JP)
MIKURIYA SHUNSUKE (JP)
Application Number:
PCT/JP2023/009225
Publication Date:
October 26, 2023
Filing Date:
March 10, 2023
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/08; B24B37/28; H01L21/304
Domestic Patent References:
| WO2014002467A1 | 2014-01-03 |
Foreign References:
| JP2008044083A | 2008-02-28 | |||
| JP2006026760A | 2006-02-02 | |||
| KR20100065562A | 2010-06-17 | |||
| JP2020055065A | 2020-04-09 | |||
| JP2015125788A | 2015-07-06 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
Download PDF:
Previous Patent: METHOD FOR PRODUCING GLASS FIBER REINFORCED POLYESTER-BASED RESIN COMPOSITION
Next Patent: SURFACTANT AND COSMETIC
Next Patent: SURFACTANT AND COSMETIC