Title:
CARRIER AND METHOD FOR MANUFACTURING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/193970
Kind Code:
A1
Abstract:
The purpose of the present invention is to suppress the adhering of an insert member to an upper surface plate of a polishing device, which is likely to occur after the completion of a polishing process, in a carrier which is used when a substrate is polished or ground and in which the insert member is provided between the substrate and an inner hole of a carrier body. The carrier has: a plate-shaped body that has an inner hole and is made of a first material; and an insert member that has a shape that fits between the substrate and the inner circumference of the inner hole, has a substrate holding hole, and is made of a second material different from the first material. The insert member includes a region bulging toward the carrier body, and when the radius of an inscribed circuit inscribed in the inner circumference of the substrate holding hole of the insert member is R, the center of gravity of the insert member is separated from the center of the inner circumferential shape of the substrate holding hole of the insert member by 0.1·R or more.
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Inventors:
VIEN TAM (VN)
Application Number:
PCT/JP2021/013124
Publication Date:
September 30, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
HOYA CORP (JP)
HOYA GLASS DISK VIETNAM LTD (VN)
HOYA GLASS DISK VIETNAM LTD (VN)
International Classes:
B24B37/28
Foreign References:
| JP2019058994A | 2019-04-18 |
Attorney, Agent or Firm:
GLOBAL IP TOKYO (JP)
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