Title:
CARRIER PLATE AND TRANSFER APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/241626
Kind Code:
A1
Abstract:
Embodiments of the present application provide a carrier plate and a transfer apparatus. The carrier plate specifically comprises an intermediate substrate, a dissociative adjustment structure, and a dissociative adhesive layer that are arranged in sequence; the dissociative adjustment structure is configured to adjust the dissociative accuracy of the dissociative adhesive layer; and the dissociative adhesive layer is configured to connect to a plurality of light emitting diode chips. The carrier plate can improve the yield rate and dissociative accuracy of the light emitting diode chips, thereby improving the yield rate and mass transfer efficiency of the light emitting diode chips during a mass transfer process.
Inventors:
LI HAIXU (CN)
Application Number:
PCT/CN2021/094195
Publication Date:
November 24, 2022
Filing Date:
May 17, 2021
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L21/683; H01L27/15; H01L33/00; H01L33/48
Foreign References:
| CN112310252A | 2021-02-02 | |||
| CN112289908A | 2021-01-29 | |||
| CN107331644A | 2017-11-07 |
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
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