Title:
CARRIER TAPE HOLE PROCESSING DEVICE USING LASER DRILLING
Document Type and Number:
WIPO Patent Application WO/2022/071728
Kind Code:
A1
Abstract:
The present invention relates to a carrier tape hole processing device using laser drilling, the device comprising: a carrier tape formed in a band shape; a working part for moving the carrier tape while the carrier tape is placed thereon; a laser drilling module disposed above the working part so as to emit a laser beam to the carrier tape placed on the working part; a position recognition part for sensing the position and the moving speed of the carrier tape placed on the working part; and a control part capable of adjusting the position of the laser beam emitted by the laser drilling module, wherein the control part adjusts the position of emission of the laser beam such that the laser beam follows the carrier tape in accordance with the moving speed of the carrier tape, recognized by the position recognition part.
Inventors:
CHOI WAN HAE (KR)
Application Number:
PCT/KR2021/013265
Publication Date:
April 07, 2022
Filing Date:
September 28, 2021
Export Citation:
Assignee:
INNOPHOTONICS CORP (KR)
CHOI WAN HAE (KR)
CHOI WAN HAE (KR)
International Classes:
B23K26/384; B23K26/06; B23K26/08; B23K101/42
Foreign References:
| JP2002134565A | 2002-05-10 | |||
| JPH11121902A | 1999-04-30 | |||
| KR101527482B1 | 2015-06-10 | |||
| KR102154285B1 | 2020-09-09 | |||
| KR20150038971A | 2015-04-09 |
Attorney, Agent or Firm:
THEWAVE IP LAW FIRM (KR)
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