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Patent Searching and Data


Title:
CARRIER TAPE FOR PACKAGING ELECTRONIC COMPONENTS, AND PACKAGING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/174676
Kind Code:
A1
Abstract:
A carrier tape for packaging electronic components, and a packaging method therefor. The carrier tape comprises grooves (20), transmission holes (10), and a through groove (30); the grooves (20) are used for loading electronic components (45); the transmission holes (10) are located at one side of the grooves (20); the through groove (30) longitudinally runs through the carrier tape; the axis of the through groove (30) is coincident with the axes of the grooves (20). The carrier tape is simple in structure and convenient to operate. When the electronic components (45) are packaged, the two sides of each groove are provided with heat sealing positions (41, 42), and the through groove (30) is provided with two heat sealing positions (43, 44), so that the carrier tape and a cover tape (40) can be subjected to four-way sealing, and the electronic components (45) are limited, thereby effectively preventing the electronic components (45) from misplacing and leaning to one side in the transportation and use processes, solving the material throwing problem affecting the packaging qualification rate and the production efficiency, and favorably improving the later SMT assembly efficiency.

Inventors:
LI ZHENGPING (CN)
ZHU YONGLI (CN)
HUANG YAOLIN (CN)
ZHAO JINYE (CN)
LIN ZHUOPENG (CN)
ZHU JIAN (CN)
Application Number:
PCT/CN2020/090178
Publication Date:
September 10, 2021
Filing Date:
May 14, 2020
Export Citation:
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Assignee:
SOLDERWELL ADVANCED MAT CO LTD (CN)
International Classes:
B65D73/02; B65B15/04; B65D85/86
Foreign References:
CN1521094A2004-08-18
CN202938699U2013-05-15
CN204021525U2014-12-17
US5115911A1992-05-26
CN205906457U2017-01-25
Attorney, Agent or Firm:
GUANGZHOU RONDA PATENT AGENCY (CN)
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