Title:
CARRYING DEVICE AND WAFER COOLING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/045252
Kind Code:
A1
Abstract:
The present application relates to a carrying device and a wafer cooling system. The carrying device is used in the wafer cooling system which comprises a base for supporting and cooling a wafer. The carrying device comprises a body component and a plurality of support components, wherein the body component is arranged around the base and can move in a first direction relative to the base; the plurality of support components are configured to support the wafer to move in the first direction, and are distributed on the body component at intervals and rotatably connected to the body component; and the support components extend in a second direction relative to the body component, are arranged opposite the base in the second direction, and are configured to rotate about the body component when subjected to an external force, the second direction being perpendicular to the first direction. The carrying device of the present application can reduce the probability of the wafer being damaged by squeezing when the wafer and the support components are misaligned in position, thereby improving the safety of the wafer during loading.
Inventors:
CAO HUI (CN)
MA LONGLONG (CN)
ZHANG JIYONG (CN)
ZHANG JIAN (CN)
HE JIDONG (CN)
MA LONGLONG (CN)
ZHANG JIYONG (CN)
ZHANG JIAN (CN)
HE JIDONG (CN)
Application Number:
PCT/CN2022/121469
Publication Date:
March 07, 2024
Filing Date:
September 26, 2022
Export Citation:
Assignee:
TAIWAN SEMICONDUCTOR MFG CO LTD (CN)
TSMC CHINA COMPANY LTD (CN)
TSMC CHINA COMPANY LTD (CN)
International Classes:
H01L21/683; H01L21/67; H01L21/677
Foreign References:
| CN216487983U | 2022-05-10 | |||
| CN110504207A | 2019-11-26 | |||
| CN113161282A | 2021-07-23 | |||
| CN102498558A | 2012-06-13 | |||
| CN111725129A | 2020-09-29 |
Attorney, Agent or Firm:
BEIJING EAST IP LTD. (CN)
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